MID Lab

MID Lab Header
© Fraunhofer IEM | Wolfram Schroll

Design revolution for technical systems

Molded interconnect devices (MIDs) offer enormous potential for the technical systems of tomorrow. Potential that is often left untapped: The complexity of development, various manufacturing processes and the reluctance to incur high costs make many companies hesitant to use this pioneering technology. We can support you in rethinking your product design with MIDs. In our MID Lab, we provide developers with modern technologies and tools for designing technical systems.

Concept

No matter if it’s a smartphone or a car: Technical systems pack lots of functions into the smallest possible installation space. MIDs revolutionize the design of integrated mechatronic systems: This space- and resource-saving technology does away with bulky circuit boards, places electronic circuits directly on three-dimensional plastic components and is the lifeblood of our MID Lab. In our fully equipped laboratory, we conceptualize, develop and validate innovative MID prototypes in combination with 3D printing.

Target group

The MID Lab provides small and medium-sized companies as well as original equipment manufacturers (OEMs) from the electronics manufacturing, sensor technology, automotive, avionics, medical engineering and plant and automation technology sectors in particular with an ideal environment in which to implement their ideas and product concepts — from the design phase to functional prototypes right through to very small series production. Turck Duotec, Condor Medical, NXP and Audi are just some of our customers who benefit from the services of the MID Lab.

Service offering

We work with you to develop your product ideas and realize and validate your prototypes. We assist you in the development of new additive manufacturing processes for mechatronic systems, from brainstorming and prototyping to the transition to series production. We are also a competent partner when it comes to technology assessments and feasibility analyses in the fields of electronics and mechatronics. In this respect, you will benefit from our technical know-how, our methodical approach as well as our expertise in systems engineering and will gain a holistic overview of your project and the way in which it develops.

© LPKF

Insight into the MID Lab

In this video, we show the metallization of MID components; copper, nickel and gold are chemically applied to the conductive tracks one after the other.

Linking of planar and spatial circuit carriers
© Fraunhofer IEM
Linking of planar and spatial circuit carriers
Production of prototypes and small series in the MID Lab
© Fraunhofer IEM
Production of prototypes and small series in the MID Lab
Chemical metallization to create conductive structures
© Fraunhofer IEM
Chemical metallization to create conductive structures